Reactive lamination of thermoplastic materials with thermosets

To generate an optical sensor foil, optical devices need to be integrated in a substrate foil. To ensure that those optical devices do not lose their shape and with it their function during the thermal treatment of the final assembly process, it is of high interest to use combinations of thermoplastic materials and thermosets. However, incompatibility is often observed between thermosets and thermoplastic materials, meaning they cannot be connected by standard processes like conventional lamination. We developed a reactive lamination process that is capable of connecting incompatible thermoplastic materials like PMMA and Cyclo Olefin Copolymer (COC). In this work, we investigate the potential of the reactive lamination process with regard to thermoplastic materials and thermosets. PMMA and COC as important high quality thermoplastic materials are connected with different thermosets like epoxy polymers and polyimide materials and the tensile stress capacity of the reactive laminates is shown.